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www.microchip.com/memory serial memory products serial eeprom serial sram serial memory products
2 serial memory products serial memory products a broad portfolio of high performance, best-in-class serial memory products to meet all your design requirements. microchip offers the broadest range of serial eeprom devices (from 128 bits to 1 mbit) over the widest operating voltage (1.7?to 5.5v) and temperature ranges (up to 150oc). innovative low-power designs and extensive testing have ensured industry leading endurance and best-in-class quality at low costs. spi-compatible serial sram devices are available in 64 and 256 kbit options and up to 20 mhz. these low power devices provide additional external serial ram with high-speed performance and are available in standard 8-pin packages. microchip supports your designs throughout the product life cycle
serial memory products 3 key bene? ts lower system costs C innovative products, tiny packages, low power consumption, fewer i / o pins, small form factor save i / o pins on the mcu C more compact designs, add additional features secure data with write-protect options highest quality eeproms ? zero ppm initiatives C triple-test ? ow ? > 1m cycles e/w endurance faster time to market ? short lead times ? complete tools support robust designs C broad operating conditions long product life cycles global sales & engineering support key features serial architecture C i 2 c, spi, un i / o , microwire broad range of densities tiny 3, 5, 6 and 8-pin packages, die & wafer innovative, low power designs industry leading endurance wide temperature and voltage range fast read and write times flexible: ? byte write capability ? package options ? custom programming options ? application-speci? c serial memory microchip owned fabs, in-house testing automotive ? ow on all products serial eeprom spi, i 2 c?, microwire, un i / o ? bus non-volatile memory 128 bits-1mbit 1.7v-5.5v 1m cycles e/w endurance fast read/write times low power consumption serial sram spi bus, 20 mhz volatile memory 8, 32 kbytes 1.5v-1.95v; 2.7v-3.6v infinite endurance zero write speeds low power outstanding quality innovative products reliable supply serial memory advantages serial memory products serial eeprom bus comparison parameter i 2 cmicrowireuni/ospi density range 128b-1 mbit 1 kb-16 kb 1 kb-16 kbit 1kb-1 mbit speed up to 1 mhz up to 3 mhz up to 100 khz up to 20 mhz i/o pins 2: clock, data 4: clock, cs, di, do 1: clock/data 4: sck, cs, di, do package options pdip, soic, soij, tssop, msop, 2x3 t-dfn, 6x5 dfn, sot-23, sc70, wlcsp pdip, soic, tssop, msop, 2x3 t-dfn, sot-23 pdip, soic, tssop, msop, 2x3 t-dfn, sot-23, to92, wlcsp pdip, soic, soij, tssop, msop, 2x3 t-dfn, 6x5 dfn, sot-23 security options hw hw sw hw, sw pricing least expensive most expensive
4 serial memory products serial eeprom robust design esd protection > 4000v human body model (hbm) > 400v machine model (mm) > 1000v charged device model latch-up protection > 200 ma on all pins esd induced latch-up > 100v (mm) on v dd ; >400v on all i / o > 1m cycles endurance and > 200 years data retention up to 150c operation (reads and writes) power-on reset (por) and brown-out reset (bor) ? effective protection against noisy automotive environments ? eliminates false writes schmitt trigger input filters for noise reduction complete traceability including die location on wafer innovative designs combined with in-house fabrication and outstanding testing methodology has helped create the industrys highest quality serial eeprom. microchip offers a broad selection of standard and application speci? c serial eeprom devices that are available in all the standard serial busses C i 2 c, spi, microwire and the new single i / o uni / o? bus. quality microchip delivers highest quality eeproms in the world world-class line yields (over 99%) iso/ts16949-compliant industry leader with triple test flow C every cell of every part is tested three times near zero ppm field bit fails statistical process control and continuous improvement procedures in all facilities robustness and reliability designed in automotive grade/flow mac address chips eui-48? & eui-64? node address partial array write protect ?, ? and whole array wp options dimm-ddr2/3 reversible s/w write protect; i 2 c extended temperature -55oc to 150oc vesa monitors ddc1?/ddc2? interface very low voltage 1.5v eeprom uni/o ? bus 1 kb-16 kb; 1.8v-5.5v spi 1 kb-1 mb; 1.8v-5.5v 8-soic (sn) 5 x 6 mm 8-dfn (mf) 5 x 6 mm 8-soic (sm) 5 x 8 mm 8-pdip (p) 8 x 9.5 mm die/wafer wl-csp . 5-sc70 (lt) 2 x 2 mm . 3-sot (tt) 3 x 2.5 mm 5 & 6-sot (ot) 3 x 3 mm . 8-tdfn (mc/mny) 2 x 3 mm . 8-msop (ms) 3 x 5 mm . 8-tssop (st) 3 x 6.5 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . specialty/application specific eeproms standard eeproms i 2 c? 128b-1 mb; 1.7v-5.5v microwire 1 kb-16 kb; 1.8v-5.5v packages serial eeproms
serial memory products 5 memory package matrix memory packages C more memory in less space! serial eeprom devices from microchip are available in a wide variety of tiny, innovative packages to help minimize your design C save board space and cost! wlcsp C die-sized package C smallest form factor eeprom package in the world! sc70 C smallest 5-lead eeprom package! 5-sot-23 available up to 64 kbit; 8-tdfn up to 128 kbit, 8-soic up to 1 mbit (i 2 c) density max speed soic sn sot-23 ot/tt tssop ts tdfn mny/mc pdip p msop ms soij sm dfn mf sc70 lt to92 to wafer w/s/wf wlcsp cs 5x6 3x3 3x6.5 2x3 8x9.5 3x5 5x8 5x6 2x2 die die i 2 c ? bus 1.7v-5.5v 128bit-2k 400 khz x 5 xxxx 5 x 4k-32k 400 khz x 5 xxxx x x 64k 1 mhz x 5 xxxxx x x 128k 1 mhz xxxxxxx xx 256k 1 mhz xx xxxx xx 512k 1 mhz xx xxx xx 1 mbit 1 mhz xxx microwire bus 1.8v-5.5v 1k-16k 3 mhz x 6 xxxx x spi bus 1.8v-5.5v 1k-4k 10 mhz x 6 xxxx x 8k-64k 10 mhz xxxxx x 128k, 256k 10 mhz xx xxx x 512k 20 mhz x 14 xxx x 1 mbit 20 mhz xxx x uni/o ? single-wire bus 1.8v-5.5v 1k-16k 100 khz x 3 xxx x x x package sizes 8-soic (sn) 5 x 6 mm 8-dfn (mf) 5 x 6 mm 8-soic (sm) 5 x 8 mm 8-pdip (p) 8 x 9.5 mm die/wafer wl-csp . 5-sc70 (lt) 2 x 2 mm . 3-sot (tt) 3 x 2.5 mm . . 5 & 6-sot (ot) 3 x 3 mm . 8-tdfn (mc/mny) 2 x 3 mm . 8-msop (ms) 3 x 5 mm . 8-tssop (st) 3 x 6.5 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . wlcsp C worlds smallest eeprom package wlcsp from microchip is bumped die with a redistribution layer to route the bond pads to the bumps. true die-sized packages industrys smallest package, form factor lowest pro? le package available in i 2 c, uni/o buses compatible with standard surface mount assembly lines fit a large density into a small space applications: mobile phones, security cameras, sensors, servers, networking, rf, medical, portable electronics wlcsp 4 kbit i 2 c <1 x 1 mm actual size enlarged to show detail wafer level chip scale packaging
6 serial memory products application-specific eeproms innovative eeprom options to help you get to market faster and deliver the highest performance at lowest costs. serial memory products C application examples microchip strengths applications automotive quality, ppap, long product life cycles, aec q-100 & tso-16949 compliant, in-house testing, triple-test ? ow transmission, abs, power train, airbag, entertainment system, mirror controllers, gps, steering control medical outstanding quality, and reliability, tiny packages, low power, microchip owned fabs blood glucose meters, hearing aid, medical imaging devices, xray, oxygen concentrator, ecg industrial robust designs, high endurance, wide operating range, custom part options metering, industrial control, security systems, alarm systems, sensor networks, battery chargers consumer short lead times, excellent supply, innovative packages, application speci? c options, low power lcd tv, set top box, printers, blue tooth, wireless, laptop, mouse, networking, ddr2/3, camera, pos, appliances specialty eeprom applications application/market design challenge solution products bene? ts monitors, projectors, flat panel display ddc1? & ddc2?, edid & e-edid speci? cation vesa products 24lcs21a, 24lcs22a quick, easy plug & play options networking, ethernet, wi-fi, zigbee? eui-48?/eui-64? mac address mac address chips 24aa02e48, 11aa02e48, 25aa02e48 easy access, low-cost, plug & play, additional eeprom pcs and laptops C dram dimm modules ddr1/2/3 speci? cation dimm spd products, temp sensor with eeprom 24lcs52, 34xx02, mcp98242 customizable software enabled wp industrial, consumer electronics systems that require locked and/or re-writeable memory write-protect options i 2 c, spi, uni/o and microwire options available one lower cost device replace two stand-alone parts hdcp chipset (tv) adding hdcp keys to your chipset secure wafer programming service 4k/8k C i 2 c, spi, microwire secure, no code duplication, lower overall costs, factory-programmed serialization industrial need devices to operate beyond -40c to +125c high temp. eeproms: up to 150c low temp eeproms: down to -55c 1 kbit, i 2 c and 1-256 kbit spi robust design, reduce chances of ? eld failures automotive automotive quali? cation special manufacturing ? ow all robust design, hassle-free solution consumer electronics, medical need very low voltage very low voltage eeproms 24vl014, 24vl024, 34vl02 low power operation, reduced system voltage
serial memory products 7 flexibility and low cost access quickly add eui-48 to your networking application and get to market faster buy code only when needed. no added programming and serialization cost C reduce system costs come with no volume restrictions. additional eeprom to store con? guration settings unique id plug-and-play devices eui-48 address embedded in a 2k-bit serial eeprom quick and easy access to ieee mac addresses C read code directly off serial eeprom available in spi, i 2 c and uni / o bus at least 1.5 kb of serial eeprom memory available in soic and sot-23 packages write-protected codes eui-48 and eui-64 compatible ? eui-48: networking, ethernet, wi-fi (ieee 802.11), bluetooth ? eui-64: zigbee (ieee802.15.4), miwi?, firewire, ipv6 eui-48?/eui-64? mac address chips need fast, easy and inexpensive access to mac addresses? use pre-programmed mac address chips from microchip. no serialization needed; unique id. eui-48 programmed serial eeproms provide low cost and easy access to ieee mac addresses. these plug-and-play devices allow you to quickly add a mac address to your networking application eliminating the need for programming and serialization on the mcu C helping you save cost and get to market quicker. for more information visit: www.microchip.com/mac 24aa02e48 100 khz i 2 c 25aa02e48 10 mhz spi 11aa02e48 100 khz uni/o more speciality eeproms i 2 c and spi serial eeproms with optional range from -55c to +150c automotive turbo chargers and exhaust gas recirculation automotive fan motors, air valves, flaps and spark plugs aerospace mining (certifications for use in explosive atmospheres available) 150 o c partial array write-protect i 2 c eeproms microchips family of partial array write-protect (wp) eeproms offers hardware write-protect capability for only a part of the memory array. these i 2 c eeprom devices are available from 1 kb-64 kbit. 32 & 64 kbit 1/4 array wp 1/2 array wp user data, real-time updates, data that changes 1 kbit-16 kbit calibration parameters, unique id, data that never changes can be custom programmed in any memory density. contact microchip sales for more information.
8 serial memory products 11aa010 1 kb 11aa020 2 kb 11aa040 4 kb 11aa080 8 kb 11aa160 16 kb 11lc010 11lc020 11lc040 11lc080 11lc160 2.5-5.5v 1.8-5.5v uni / o? eeprom using uni / o eeprom can free up mcu pins for new features. microchips new uni / o serial eeprom uses only one connection to the host microcontroller. this compares to two or three pins for i 2 c, and three to six pins for microwire or spi buses. this new, proprietary bus offers advanced features like a status register and write-protection on demand, along with all i / o and memory array and command functions through a single pin. save i / o pins a single i / o eeprom can simplify your design and reduce system cost free up pins on the mcu ? add new features to your application ? move to a smaller mcu C reduce cost free up pins on your connector ? smaller connector C lower cost single i / o interface C more compact design single i / o eeprom one i / o for clock, data & control single i / o interface 1-16 kbit memory densities 1.8-5.5v operating voltage 10-100 khz operating frequency status register, sw write-protect 3-pin sot-23, 8-pin soic, msop & tdfn 1m erase/write cycles uni / o software drivers available for many popular microcontrollers see ap note section for more information. convert uni / o from 3-pins to 2-pins C check out ap note an1213. v cc mcu uni/o ? v cc i 2 c? uni/o ? v cc v cc r1 r2 i 2 c? sda scl wp single i/o, no pull-up resistors needed. save board space save pins on the mcu add additional features v cc mcu sda scl wp www.microchip.com/unio the uni/o advantage
serial memory products 9 the serial advantage C not just price feature traditional parallel sram microchip serial sram i/o connection to mcu 16-20 4 standby current 3 ma 1 a active current 50 ma 1-10 ma lowest operating voltage 3.0v 1.7v footprint 100 mm 2 20 mm 2 smallest packages 28-tssop, 28-soic 8-tssop, 8-soic do you need a simple, inexpensive way to add ram to your application? microchip offers external ram where you need it. microchips new serial sram family provides a way to easily and inexpensively add external ram to almost any application. these serial devices use less power and fewer i / o connections than traditional parallel sram. and, they allow designers to use a smaller microcontroller rather than moving to a larger microcontroller just to get more on-board ram. serial sram flexible ram expansion quickly and easily add external high-speed sram 8 and 32 kbyte options 20 mhz clock speed low standby and operating currents fast writes with zero latency unlimited endurance 8-soic, 8-tssop , 8-pdip increased performance add features to your current microcontroller and get to market faster add functionality to your current design no need to buy a large microcontroller just for the ram familiar 4-pin spi interface cost reduce your current design scratchpad, buffering, high endurance applications applications: m etering, pos terminals, printers, internet radio, ethernet, wi-fi replace parallel ram any application needing low cost ram 23a640 16 mhz 1.5v-1.95v 23k640 20 mhz 2.7v-3.6v 64 kb 23a256 16 mhz 23k256 20 mhz 256 kb parallel sram www.microchip.com/sram
10 serial memory products wafer-level burn-in main goals C zero defects full verification of data sheet parameters for functional compliance at die and package level. removal of manufacturing defects to ensure highest quality and reliability. screening out of functional devices that may fail in the future. 1: wafer probe full functional tests on 100% of die and bits; 85oc or 125oc 5000 erase/write cycles on all bits key aspects: endurance testing maverick hvst tvpp ? 250oc up to 24 hours ? equivalent to 100 years at 85oc key aspects: functional test verify margins gbn edio lvhf sby 2: wafer probe 2nd 100% bit test (25oc) full-functional screen any die with charge loss in any cell between the 2 probes is rejected to prevent infant mortality retention bake 3: assembly & final test microchips triple test and wafer-level burn-in procedure moving beyond traditional burn-in to wafer level burn-in with the triple test flow specifically targeted for memory cells has helped create the industrys most reliable memory products. extensive testing C every cell in every die is tested three times, including specific endurance and data retention tests to ensure highest quality. hvst, lvhf and tvpp tests target specific defects. maverick, sby and gbn target overall failure patterns and trends. insight into failure modes along with flexible test flow ensures continues improvement. traditional burn-in (old technology) general purpose non-specific testing procedure for random logic cells non-specific and untargeted testing mechanism C increases failure rates. expensive, time consuming and inefficient. introduces defect modes like bent leads and eos that sometimes go undetected . triple test flow microchip tests every cell in wafer form twice, then performs a final test after assembly. microchips best-in-class field performance is the combined result of world class manufacturing, wafer level burn-in and wafer probe quality screens. microchips triple test flow is currently the most robust testing procedure for serial eeprom devices in the industry. it tests each cell of each die three times and also performs extensive endurance and data retention tests to ensure quality and reliability. infant mortality of microchip serial eeproms is among the lowest in the industry due to this extensive testing, excellent fabrication and highly reliable memory cell design. good die in a bad neighborhood (gbn) and edge die ink out (edio) special algorithms target devices that function, but are suspect because of their proximity to clusters of failing devices or edge die. wafer probe quality screens microchip performs additional in-house testing during wafer probe to ensure quality and eliminate any devices that are outside the normal distribution or might possibly fail in the future. high voltage stress test (hvst) hvst targets weak devices with oxide defects in ram and logic circuits by stressing the oxides at higher than normal voltages. time at vpp (tvpp) tvpp targets oxide defects in eeprom cells, charge pumps and other high-voltage circuits. programming voltages (v pp ) are applied to the memory array for an extended period of time in order to highlight any weak devices. low voltage high frequency (lvhf) lvhf targets signal paths that are partially blocked and therefore more resistive than normal. lvhf eliminates these devices by requiring them to operate faster than specified and at voltages lower than specified. what does all of this mean? <<1 ppm field failures best-in-class endurance industry-leading data retention failing die passing die rejected by gbn screen rejected by edio screen rejected by edio screen (concept)
serial memory products 11 consistent, reliable supply of the highest quality products perfected testing mechanisms along with streamlined in-house fabrication ensures the highest ef? ciency, shortest lead times and lowest costs. quality comes first is at the top of the list of guiding values for microchip technology. as an iso/ts-16949 certified supplier since 2003, microchips aggregate system uniquely supports our commitment to exceptional quality. in an environment where enterprise-wide commitment to continuous improvement is demonstrated and every employee is responsible for quality. with more than 20 years of experience in serving the demanding requirements of customers worldwide, microchip technology has a proven track record of success in delivering the total product solution to our valued customers that is cost effective and reliable. corporate headquarters chandler, arizona fab 2 tempe, arizona fab 4 gresham, oregon product assembly/test bangkok, thailand www.microchip.com/quality eeproms built at microchip owned fabs (gresham, or, tempe, az) no obsolescence policy C industrys longest product life cycles 100% in-house testing on all of our products aecq100, ts19649 and automotive grade compliant industrys shortest lead times excellent global sales and technical support microchip: a leader in non-volatile memory for over 20 years.
12 serial memory products mplab? starter kit for serial memory products (dv243003) reduce time to market and create a rock-solid design using the mplab starter kit for serial memory products. it includes everything necessary to quickly develop a robust and reliable serial eeprom design, and greatly reduces the time required for system integration and hardware/software fine-tuning. 3.3v and 5.0v on-board voltage selection supports microchip uni / o bus, i2c, spi and microwire serial eeproms 1.8v to 5.5v external voltage support includes free copy of mplab ide usb interconnect total endurance? software total endurance software provides a comprehensive model that helps estimate the endurance and reliability of microchip serial eeprom devices. by providing operating conditions based on your application, all design trade-offs affecting reliability can be accurately estimated both graphically and numerically in ppm, fit and mtbf modes, saving time and ensuring a truly robust design. resources to get you started quickly reduce development time and cost with our development tools. competitive market conditions force businesses to examine every aspect of their product life cycle to maximize productivity and minimize expense. easy-to-learn, low-cost common development tools are one way to reduce risk and get to market quicker. uni/o? bus parasitic power demo board (ac243004) the uni / o bus parasitic power demo board is designed to illustrate how a standard half-wave rectifier and capacitor circuit can be used to parasitically extract power for a uni / o device from the scio signal as described in application note, an1213 powering a uni / o? bus device through scio . this reduces the number of connections necessary for adding a uni / o device to your application down to two: scio and v ss . serial eeprom pim pictail? pack (ac243003) the serial eeprom pim pictail modules are a series of boards designed around microchip serial eeprom devices. the boards are designed to interface with the pictail plus connector as well as the mplab starter kit for serial memory products and the pickit 3, allowing you to get started right out of the box. plug-and-play with pictail plus connector and pickit 3 connector test points for oscilloscope connections for firmware debugging (i2c and uni / o only) microwire buses are included for maximum flexibility in developing your application www.microchip.com/devtools
serial memory products 13 reference code resources looking for reference code to interface with our serial memory? select your serial protocol, microcontroller and preferred implementation below. memory application notes C pic? mcus protocol memory type recommended usage implementation pic10 pic12 pic16 pic18 pic24/ dspic33 pic32 uni / o bus eeprom an1194 (general usage) assembly C firmware delay an1174 1 an1174 1 an1188 2 an1174 1 an1188 2 an1183 an1213 (parasitic power) assembly C hardware delay an1196 2 an1196 2 an1187 c C hardware delay an1251 2 an1251 2 an1191 an1236 i2c eeprom an1028 assembly C bit bang an982 an982 an974 an979 assembly C hardware port an976 an989 c C bit bang an997 an1100 c C hardware port an991 an1079 microwire eeprom an1029 assembly C bit bang an993 an999 assembly C hardware port an975 an1020 c C bit bang an1004 c C hardware port an1023 spi eeprom an1040 assembly C bit bang an909 an1006 assembly C hardware port an966 AN1000 c C bit bang an1018 an1096 c C hardware port an1040 an1069 sram an1245 C an1287 an1269 an1262 an1277 all eeproms an1019 eeprom endurance tutorial an536 basic serial eeprom operation an603 continuous improvement note 1: written for baseline (12-bit program word) cores. 2: written for mid-range (14-bit program word) cores. memory application notes C third-party mcus protocol implementation 8051 msp430 uni/o bus assembly C hardware delay an1184 c C hardware delay an1185 an1186 i2c assembly C bit bang an1147 assembly C hardware port an1190 c C bit bang an1195 c C hardware port an1113 spi assembly C bit bang an1198 assembly C hardware port an1197 c C bit bang an1193 c C hardware port an1073 www.microchip.com/appnotes
14 serial memory products product specifications i 2 c? memory products device density (organization) max clock frequency operating voltage (aa, lc, c) temperature (i, e, h) endurance (e/w cycles) data retention write protect (hardware) packages 24xx00 128 bits (x8) 400 khz 1.7v-5.5v -40c to +125oc 1m 200 years no pdip, soic, tssop, sot-23, 2x3 t-dfn 24xx01/014 1 kbit (x8) 400 khz 1.7v-5.5v -40c to +150oc 1m 200 years w, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, sc70 24xx02/024 2 kbits (x8) 400 khz 1.7v-5.5v -40c to +125oc 1m 200 years w, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, sc70 24xx04 4 kbits (x8) 400 khz 1.7v-5.5v -40c to +125oc 1m 200 years w, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, wlcsp 24xx08 8 kbits (x8) 400 khz 1.7v-5.5v -40c to +125oc 1m 200 years w, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop 24xx16 16 kbits (x8) 400 khz 1.7v-5.5v -40c to +125oc 1m 200 years w, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, wlcsp 24xx32 32 kbits (x8) 400 khz 1.7v-5.5v -40c to +125oc 1m 200 years w, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, wlcsp 24xx64/65 64 kbits (x8) 1 mhz 1.7v-5.5v -40c to +125oc 1m/10m 200 years w, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, wlcsp 24xx128 128 kbits (x8) 1 mhz 1.7v-5.5v -40c to +125oc 1m 200 years yes pdip, soic, tssop, 2x3 t-dfn, 6x5 dfn, msop, wlcsp 24xx256 256 kbits (x8) 1 mhz 1.7v-5.5v -40c to +125oc 1m 200 years yes pdip, soic, tssop, 6x5 dfn, msop, wlcsp 24xx512 512 kbits (x8) 1 mhz 1.7v-5.5v -40c to +125oc 1m 200 years yes pdip, soic, tssop, 6x5 dfn, wlcsp 24xx1025 1 mbit (x8) 1 mhz 1.7v-5.5v -40c to +125oc 1m 200 years yes pdip, soic, soij, 6x5 dfn spi eeprom products device density (organization) max clock frequency operating voltage (aa, lc) temperature (i, e, h) endurance (e/w cycles) data retention write protect (software) packages 25xx010a 1 kbit (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, 2x3 t-dfn, msop, sot-23 25xx020a 2 kbits (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, 2x3 t-dfn, msop, sot-23 25xx040a 4 kbits (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, 2x3 t-dfn, msop, sot-23 25xx080c/d 8 kbits (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, msop, 2x3 t-dfn 25xx160c/d 16 kbits (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, msop, 2x3 t-dfn 25xx320a 32 kbits (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, msop, 2x3 t-dfn 25xx640a 64 kbits (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, msop, 2x3 t-dfn 25xx128 128 kbits (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, 6x5 dfn 25xx256 256 kbits (x8) 10 mhz 1.8v-5.5v -40c to +150oc 1m 200 years w, ?, ? pdip, soic, tssop, 6x5 dfn 25xx512 512 kbits (x8) 20 mhz 1.8v-5.5v -40c to +125oc 1m 200 years w, ?, ? pdip, soic, 6x5 dfn 25xx1024 1 mbit (x8) 20 mhz 1.8v-5.5v -40c to +125oc 1m 200 years w, ?, ? pdip, soij, 6x5 dfn 1. voltage range: aa = 1.7- 5.5v; lc = 2.5-5.5v; c = 4.5-5.5v 2. i = -40oc to 85oc; e = -40oc to 125oc; h = -40oc to 150oc 3. pb-free, halogen free and rohs compliant 4. write protect: w = whole array, ? = half array, ? = quarter array 5. esd protection > 4 kv (hbm); > 400v (mm) on all pins 6. h temp is soic only microwire eeprom products device density (x8 or x16) max clock frequency operating voltage (aa, lc, c) temperature (i, e) endurance (e/w cycles) data retention write protect (hardware) read current packages 93xx46a/b/c 1 kbit 3 mhz 1.8v-5.5v -40c to +125oc 1m 200 years no 1 ma pdip, soic, tssop, sot-23, 2x3 t-dfn, msop 93xx56a/b/c 2 kbits 3 mhz 1.8v-5.5v -40c to +125oc 1m 200 years no 1 ma pdip, soic, tssop, sot-23, 2x3 t-dfn, msop 93xx66a/b/c 4 kbits 3 mhz 1.8v-5.5v -40c to +125oc 1m 200 years no 1 ma pdip, soic, tssop, sot-23, 2x3 t-dfn, msop 93xx76a/b/c 8 kbits 3 mhz 1.8v-5.5v -40c to +125oc 1m 200 years yes 1 ma pdip, soic, tssop, 2x3 t-dfn, msop 93xx86a/b/c 16 kbits 3 mhz 1.8v-5.5v -40c to +125oc 1m 200 years yes 1 ma pdip, soic, tssop, 2x3 t-dfn, msop a: x8 organization, b: x16 organization, c: selectable x8 or x16 organization uni / o ? bus eeprom products device density (organization) max clock frequency operating voltage (aa, lc) temperature (i, e) endurance (e/w cycles) data retention write protect (software) packages 11xx010 1 kbit (x8) 100 khz 1.8v-5.5v -40c to +125oc 1m 200 years w, ?, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, to92, wlcsp 11xx020 2 kbits (x8) 100 khz 1.8v-5.5v -40c to +125oc 1m 200 years w, ?, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, to92, wlcsp 11xx040 4 kbits (x8) 100 khz 1.8v-5.5v -40c to +125oc 1m 200 years w, ?, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, to92, wlcsp 11xx080 8 kbits (x8) 100 khz 1.8v-5.5v -40c to +125oc 1m 200 years w, ?, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, to92, wlcsp 11xx160 16 kbits (x8) 100 khz 1.8v-5.5v -40c to +125oc 1m 200 years w, ?, ? pdip, soic, tssop, sot-23, 2x3 t-dfn, msop, to92, wlcsp serial sram products device density organization) max clock frequency operating voltage (a, k) temperature (i, e) read current (ma) max standby current packages 23x640 8kb (64 kbits) 20 mhz 1.8v, 3v -40c to +125oc 3 ma 4 a pdip, soic, tssop 23x256 32 kb (256 kbits) 20 mhz 1.8v, 3v -40c to +125oc 3 ma 4 a pdip, soic, tssop 1. voltage range: a = 1.5- 1.95v; k = 2.7v-3.6v 2. all devices are pb-free, rohs compliant and halogen free for up to date product information visit: www.microchip.com/memory
serial memory products 15 package type: sn 8-soic (150 mil) tt/ot 3/5/6 sot-23 st 8-tssop p 8-pdip sm 8-soij (208 mil) ms 8-msop operating temperature range: i: industrial (-40c to +85c) e: extended industrial range (-40c to +125c) h: extended (-40c to +150c) tape and reel t: tape and reel blank: standard (bulk) density: 00: 128 bits 01/010/014: 1 kbit 02/020/024: 2 kbit 04/040: 4 kbit 08/080: 8 kbit 16/160: 16 kbit voltage range: aa 1.8v-5.5v lc 2.5v-5.5v c 4.5v-5.5v k 1.8-3.6v a 1.5-1.95v vl 1.5v-3.6v bus type: 24/34: i 2 c 25: spi 93: microwire 11: un i / o bus 23: sram (spi) part number suffix designations ordering information for microchip seeprom products. 24 aa 02 t - i /sn serial memory ordering information we can pre-program your eeproms before they ship. microchip offers custom programming options in package and die: qtp C all devices are programmed with same data sqtp C each device is programmed with unique data do you have special product requirements? microchip offers customized versions of existing products: lower v dd (<1.5v in some cases) extreme temperature (< -55oc to >+150oc) more endurance, up to 10m cycles lower current specs (read, write, standby) higher speed customer design modi? cations: ? different i 2 c and uni / o addresses ? custom voltage ranges get started today additional resources at: www.microchip.com/memory datasheets and application notes (with code) verilog, ibis models usage recommendation ap notes webinars at www.microchip.com/webinars samples at www.microchip.com/samples tools and demo boards mny/mc/mf 8-tdfn/dfn lt 5-sc70 w/wf/s wafer/die cs wlcsp C die size to to92 32/320: 32 kbit 64/640: 64 kbit 128: 128 kbit 256: 256 kbit 512: 512 kbit 1024/1025: 1 mbit programming & special services
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